22L buried + buried high multilayer rigid flex pcb,Metal Substrate PCB,Buried, buried resistance PCB,pcb copper board
Product Description
- Product field: military system module
- Number of layers: 22L buried + buried high multilayer,impedance Ω±10%, Resin plug hole + copper fill hole
- Plate thickness: 6.5mm
- Process structure: FR-4, TG180+ deep digging recessed IC capacitor + resistor
- Surface treatment: immersion gold
- Packing: vacuum packaging + tin wrapped paper + desiccant + humidity card + carton
- Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.
In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required
PCB, FPC process production capability
| Technical ltem |
MassProduct |
Advanced Technology |
| 2016 |
2017 |
2018 |
| Max.Layer Count |
26L |
36L |
80L |
| Through-hole plate |
2～45L |
2～60L |
2～80L |
| Max.PCBSize(in) |
24*52" |
25*62" |
25*78.75" |
| The layer number of FPC |
1～36L |
1～50L |
1～60L |
| Max.PCBSize(in) |
9.8"*196" |
9.8"*196" |
10"*196"Reel to reel |
| Layeredplatelayer |
2～12L |
2～18L |
2～26L |
| Max.PCBSize(in) |
9"*48" |
9"*52" |
9"*62" |
| Combination of hard and soft layers |
3～26L |
3～30L |
3～50L |
| Interconnect HDI |
5+X+5Interconnect HDI |
7+X+7Interconnect HDI |
8+X+8,Interconnect HDI |
| HDI PCB |
4～45L |
4～60L |
4～80L |
| Interconnect HDI |
3+20+3 |
4+X+4Interconnect HDI |
4+X+4,Interconnect HDI |
| Max.PCBSize(in) |
24"*43" |
24"*49" |
25"*52" |
| Material |
FR-4 Rogers |
FR-4 Rogers |
FR-4 Rogers |
| Base material |
Halogenfree,LowDK |
Halogenfree,LowDK |
Halogenfree,LowDK |
| Build-up Material |
FR-4 |
FR-4 |
FR-4 |
| BOard,Thickness(mm) |
Min.12L(mm) |
0.43 |
0.42～8.0mm |
0.38～10.0mm |
| Min.16L(mm) |
0.53 |
1.60～8.0mm |
0.45～10.0mm |
| Min.18L(mm) |
0.63 |
2.0～8.0 |
0.51～10.0mm |
| Min.52L(mm) |
0.8 |
2.50～8.0mm |
0.65～10.0mm |
| MAX(mm) |
3.5 |
10.0mm |
10.0mm |
| Min.CoreThickness um(mil) |
254"(10.0) |
254"(10.0) |
0.10～254(10.0mm) |
| Min.Build up Dielectric |
38(1.5) |
32(1.3) |
25(1.0) |
| BaseCopperWeight |
Inner Layer |
4/1-8 OZ |
4/1-15 OZ |
4/1-0.30mm |
| Out Layer |
4/1-10 OZ |
4/1-15 OZ |
4/1-30 OZ |
| Gold thick |
1～40u" |
1～60u" |
1～120u" |
| Nithick |
76～127u" |
76～200u" |
1～250u" |
| Min.HOle/Land um(mil) |
150/300(6/12) |
100/200(4/8) |
100/200(4/8) |
| Min.Laser via/landum(mil) |
60/170(2.4/6.8) |
50/150(2/6) |
50/150(2/6) |
| Min. IVH,Hole size/landum(mil) |
150/300(6/12) |
100/200(4/8) |
100/200(4/8) |
| DieletricThickness |
38(1.5) |
32(1.3) |
32(1.3) |
| 125(5) |
125(5) |
125(5) |
| SKipvia |
Yes |
Yes |
Yes |
| viaoNhie(laserviaon BuriedPTH) |
Yes |
Yes |
Yes |
| Laser Hole Filling |
Yes |
Yes |
Yes |
| Technicalltem |
Mass Product |
Advanced Technolgy |
| 2017year |
2018year |
2019year |
| Drill hole depth ratio |
ThroughHole |
2017year |
.40:1 |
.40:1 |
| Aspet Ratio |
Micro Via |
.35:1 |
1.2:1 |
1.2:1 |
| Copper Filling Dimple Size um(Mil) |
10(0.4) |
10(0.4) |
10(0.4) |
| Min.LineWidth＆space |
lnner Layer um(mil) |
45/45(1.8/1.8) |
38/38(1.5/1.5) |
38/38(1.5/1.5) |
| Plated Layer um(mil) |
45/45(1.8/1.8) |
38/38(1.5/1.5) |
38/38(1.5/1.5) |
| BGAPitch mm(Mil) |
0.3 |
0.3 |
0.3 |
| Min.PTH Hole ring um(mil) |
75(3mil) |
62.5(2.5mil) |
62.5(2.5mil) |
| Line Width Control |
∠2.5MIL |
±0.50 |
±0.50 |
±0.50 |
| 2.5Mil≤L/W∠4mil |
±0.50 |
±0.50 |
±0.50 |
| ≦3mil |
±0.60 |
±0.60 |
±0.60 |
| Laminated structure |
Layer by layer |
3+N+3 |
4+N+4 |
5+N+5 |
| Sequential Build-up |
20L Any Layer |
36L Any Layer |
52L Any Layer |
| Multi-layer overlay |
N+N |
N+N |
N+N |
| N+X+N |
N+X+N |
N+X+N |
| sequential Lamination |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
| Soft and hard bonding |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
| PTH filling process |
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.
Product Tags:
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Multilayer Copper Metal Substrate PCB Buried Resistance 1oz Copper Thickness 22L buried + buried high multilayer rigid f Images
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